International Data Center & Cloud Computing Industry Expo 2025
2025 Green Intelligent Computing Center and Computility Industry Expo
Shanghai New International Expo Center,P R China (SNIEC)
18 - 20 November 2025
HUAWEI TECHNOLOGIES CO., LTD
Booth Number: Hall W5 - W5D25
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FUSIONPOWER9000
Factory pre‑integration and pre‑commissioning reduce the time‑to‑market from 30 weeks to 18 weeks. One cabinet per circuit, decoupling the electrical room from the building and enabling on‑demand capacity expansion. Each cabinet delivers 2.4 MW, reducing the footprint by 30% compared with conventional solutions.
FUSIONCOL600-L450MA
Dual AC/DC DC architecture, dual‑path switching with "zero interruption," and a 2N redundancy design for critical components; one‑button maximum cooling and emergency power shutdown, enabling rapid response to urgent faults. Modular hot‑swappable design allows quick maintenance of key components in just one minute; one‑button self‑diagnosis of the expansion tank; and fast refrigerant replenishment in five minutes. 3C proximity rating; 15% reduction in outdoor cold‑source power consumption; AI‑driven intelligent optimization delivers a 30% improvement in overall efficiency.
FUSIONMODULE2000
Rack-level air conditioning combined with sealed hot‑and‑cold aisles delivers highly efficient cooling; iCooling energy‑efficiency optimization achieves an annual average PUE as low as 1.111 in Beijing. A fully modular architecture—each module functions as a standalone data center—enables on-demand deployment and flexible capacity expansion. Local 43‑inch smart management display provides visualized asset management, boosting resource utilization by 20%. UPTIME Tier IV Ready; an innovative power supply architecture ensures continuous cooling, preventing overheating even during power outages.
思源黑体预加载(勿删): HUAWEI TECHNOLOGIES CO., LTD